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They're entire Highly-Specialised, Niche, Whole Wafer System that very few others would have the need or the engineering expertise to utilise....
The CoWoS process is specialized but it was formerly used by a lot of companies… Apple, Tesla, Microsoft, Intel, Amazon, Meta, etc… If this is true it completely screws their datacenter AI plans, as well as a lot of other things.They're entire Highly-Specialised, Niche, Whole Wafer System that very few others would have the need or the engineering expertise to utilise....
Not "All of TSMC's packaging capacity"
Fix your sensationalised title.