(cf)Eclipse
Freelance Overclocker
- Joined
- Feb 18, 2003
- Messages
- 30,027
ok, to follow up on tenchi's post on his process of removing the heatspreader from his a64, i planned out the same. i have about half of my data, but i can't get any further for one reason:
my core isn't flat
and i don't have sandpaper here in my dorm to fix it.
now my thought was that this would explain why some people have better temps given the same setup than others. the chips with flat cores will definitly get better contact with the core than the ones with a slight round in it.
and a word of warning for those who take the IHS off, it's difficult to remove fully. i was able to get about 1/2 of the silicon type glue off with the knife i had. ironically, i used a sharp edge of an ecplise gum package to cut the rest of the glue.
then i bent the metal "clamp" that tightens my zalman heatsink down to compensate for the missing IHS.. it seems to be giving the proper amount of pressure, but i definitly don't feel safe moving my case around too much
once i get ahold of some sandpaper, i'll update this and give you the results of my heatspreader removal, cause right now, my load temps are like 2ºc higher than before (after taking ambient into consideration), and that's at the low power setting (2ghz, 1.3v = ~52 watts) i'm afraid i might kill something if i pump up the voltage without full contact
my core isn't flat
and i don't have sandpaper here in my dorm to fix it.
now my thought was that this would explain why some people have better temps given the same setup than others. the chips with flat cores will definitly get better contact with the core than the ones with a slight round in it.
and a word of warning for those who take the IHS off, it's difficult to remove fully. i was able to get about 1/2 of the silicon type glue off with the knife i had. ironically, i used a sharp edge of an ecplise gum package to cut the rest of the glue.
then i bent the metal "clamp" that tightens my zalman heatsink down to compensate for the missing IHS.. it seems to be giving the proper amount of pressure, but i definitly don't feel safe moving my case around too much
once i get ahold of some sandpaper, i'll update this and give you the results of my heatspreader removal, cause right now, my load temps are like 2ºc higher than before (after taking ambient into consideration), and that's at the low power setting (2ghz, 1.3v = ~52 watts) i'm afraid i might kill something if i pump up the voltage without full contact