![[H]ard|Forum](/styles/hardforum/xenforo/logo_dark.png){kind=logo}
(cf)Eclipse
Freelance Overclocker
- Joined
- Feb 18, 2003
- Messages
- 30,027
(continued from this post http://www.hardforum.com/showthread.php?t=851884 )
all righty, sorry about the long delay, there were some issue surrounding the lapping of my core. i really should have thought to take pictures before i put everything back together, but this turned into a project for those times when i couldn't sleep, and the light and flash required to take a decent picture would have woken up my roommate
for those of you who lap the core (tenchi, listen up here), it's surprisingly difficult. before you say "bah, you can't lap your mom" or something equally silly, i've been doing this kind of thing for a long time. hell, my lapped slk-900 dropped temps considerably.
the real challenge comes from two things:
one, the core is small, thus when you push the cpu forward, there is more pressure on the front. this creates an uneven surface. to counter this, you can alternate, but my core was round to begin with, and i wanted it flat, so this wouldn't work too well. i ended up just moving my finger and hoped the changed center of pressure would be close enough to the right spot to not make it uneven. this almost worked. the core is flatter.. but not too much more so.
second: normally when i lap things, i use running water to keep everything clean so that the surface doesn't get scratched up from the removed material. with a cpu core, i thought this wasn't too wise. so no shiny finish on the core.
ok, with that in mind, and finally over with (took a few nights), i reapplied thermal paste and the heatsink. i actually did that with the a64 core, the drop or line down the middle doesn't work quite as well as the apply thin layer method. problem with the thin layer is that since the cpu still isn't as flat as i would have liked, some parts of the as5 needed to be thicker than others, and i found it difficult to do this right, so i over applied slightly and hoped the excess would get squeezed out over time.. though as5 is pretty thick. just for the curious, first time i booted up my computer after lapping....
2.3ghz, 1.57v, ambient = 12c (yeah.. my window was open all the way and it rocked to have the room that cold)
load: 54c
idle: 23c (this is with c&q on)
now, the as5 has settled for the most part..
same cpu specs, 18.5c ambient
load: 40
idle: 22
moral of the story: if you get horrible temps just after you build the computer, don't be put off.. it's probably just the thermal paste being retarted.
so now onto the real data. i apologize for the large size of the main chart of data. i recorded a lot of stuff, thus it's very complicated. for those who don't need the nitty gritty details, just look at the chart and bar graph below. i'll explain what it means in a moment.
data chart i have the speed, voltage, calcuated heat outpur, ambient for each test, the load and idle, the change in temp between the load and idle, and the change in temps i got from removing the ihs, then the change i got from lapping the core. ihs removal definitly wins
so now for the charts. first one is the temperature of the core over the ambient temperature outside the case. for those who wonder, the x-axis is the calcuated heat output of the cpu, and y is the change in temperature
this bar graph is the change in temperature between idle and load with the various speeds and core furnishings
now.. i'll probably give some random information as i remember it when you guys ask questions, so ask away. and i apologize for those of you with small screens.. i umm. yeah, i got lazy and just used whatever graph size excel gave me. i'll try to change them if a bunch of people complain.
oh, quick update: i tried running the 118 watt test with the window off.. 46ºc load temp with 19ºc ambient. quite impressive, since before my computer would only be about 5c cooler running at 1/2 the heat output.
edit: yeah, if the pics don't work.. i've hit the 500meg/month limit of my server *cries*
all righty, sorry about the long delay, there were some issue surrounding the lapping of my core. i really should have thought to take pictures before i put everything back together, but this turned into a project for those times when i couldn't sleep, and the light and flash required to take a decent picture would have woken up my roommate
for those of you who lap the core (tenchi, listen up here), it's surprisingly difficult. before you say "bah, you can't lap your mom" or something equally silly, i've been doing this kind of thing for a long time. hell, my lapped slk-900 dropped temps considerably.
the real challenge comes from two things:
one, the core is small, thus when you push the cpu forward, there is more pressure on the front. this creates an uneven surface. to counter this, you can alternate, but my core was round to begin with, and i wanted it flat, so this wouldn't work too well. i ended up just moving my finger and hoped the changed center of pressure would be close enough to the right spot to not make it uneven. this almost worked. the core is flatter.. but not too much more so.
second: normally when i lap things, i use running water to keep everything clean so that the surface doesn't get scratched up from the removed material. with a cpu core, i thought this wasn't too wise. so no shiny finish on the core.
ok, with that in mind, and finally over with (took a few nights), i reapplied thermal paste and the heatsink. i actually did that with the a64 core, the drop or line down the middle doesn't work quite as well as the apply thin layer method. problem with the thin layer is that since the cpu still isn't as flat as i would have liked, some parts of the as5 needed to be thicker than others, and i found it difficult to do this right, so i over applied slightly and hoped the excess would get squeezed out over time.. though as5 is pretty thick. just for the curious, first time i booted up my computer after lapping....
2.3ghz, 1.57v, ambient = 12c (yeah.. my window was open all the way and it rocked to have the room that cold)
load: 54c
idle: 23c (this is with c&q on)
now, the as5 has settled for the most part..
same cpu specs, 18.5c ambient
load: 40
idle: 22
moral of the story: if you get horrible temps just after you build the computer, don't be put off.. it's probably just the thermal paste being retarted.
so now onto the real data. i apologize for the large size of the main chart of data. i recorded a lot of stuff, thus it's very complicated. for those who don't need the nitty gritty details, just look at the chart and bar graph below. i'll explain what it means in a moment.
data chart i have the speed, voltage, calcuated heat outpur, ambient for each test, the load and idle, the change in temp between the load and idle, and the change in temps i got from removing the ihs, then the change i got from lapping the core. ihs removal definitly wins
so now for the charts. first one is the temperature of the core over the ambient temperature outside the case. for those who wonder, the x-axis is the calcuated heat output of the cpu, and y is the change in temperature
this bar graph is the change in temperature between idle and load with the various speeds and core furnishings
now.. i'll probably give some random information as i remember it when you guys ask questions, so ask away. and i apologize for those of you with small screens.. i umm. yeah, i got lazy and just used whatever graph size excel gave me. i'll try to change them if a bunch of people complain.
oh, quick update: i tried running the 118 watt test with the window off.. 46ºc load temp with 19ºc ambient. quite impressive, since before my computer would only be about 5c cooler running at 1/2 the heat output.
edit: yeah, if the pics don't work.. i've hit the 500meg/month limit of my server *cries*