HardOCP News
[H] News
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- Dec 31, 1969
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IBM says that the company has developed a way to make processors run up to one third faster or use fifteen percent less power by using a self assembling material.
The computer services and technology company said the new process allows the wiring on a chip to be insulated with vacuum, replacing the glass-like substances used for decades but which have become less effective as chips steadily shrink.