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Wrong, there are multiple solutions. One is that I can not buy one (your only offered choice), one is that I can wait until others have figured out how to improve on the current IVB IHS system and then buy one, one is that I can wait until others have figured out how to improve the cooling and see if a cheaper version of the chip which comes out which is unpackaged.... Now I can combine all of these solutions with the practice of rubbing everybodies' faces in the fact that they are getting a Ferrari with cement wheels right now.
What are you smoking? Of course the new process and transistor density causes heat to be more concentrated into a smaller area. While total heat given off by the chip is less than SB, this lesser amount is dissipated over a smaller area (so the temperature is higher at each point on the surface). Hence the need for a higher quality cooling system, hence the need to use a better method to remove the heat from the chip. So now you have to ask yourself which is a better system to remove heat from the chip, solder or TIM? Think about it. I like anandthech, but you have to understand, they are not independent journalists, they have an interest in getting their engineering samples ahead of time from manufacturers like Intel. They are biased and the last thing they want to do is bite the hand that feeds them. Use your brain, think about TIM vs. Solder and dont let others persuade you when you know they have an interest in the issue already.
At least I don't let others do all my thinking. If that is the dumbest thing you have heard you should listen to yourself sometime.
I don't think there will be revisions. The later chips might benefit from process maturity but considering the biggest factor in the added heat, the density of the die itself, isn't changing then there's likely not going to be much of a difference.
It's still a great chip, though. If you're overclocking you'll get somewhere in the 4.4/4.5ghz area with decent cooling but I wouldn't expect much more unless you spend >$60 on a top end air cooler or low level water cooling. The additions to Quicksync and PCIE 3.0 are great, but if you're looking for the highest OC possible then you're better off buying a 2700K or 2600K for cheaper. If you're not overclocking then you have nothing to worry about
Yeah, Intel always leaves some headroom, but that's not something I could plug into the analysis. My calculation include the unspoken assumption that at any particular voltage you are running at the highest stable clock speed.
That's most likely due to contact. When you take off the casing you're not going to have a clean fit. That's all the more reason to not mess with it. Changing TIMs also won't result in any major benefit either than maybe a couple of degrees.
But note how small the chip is compared to the cooler
That's leaving a lot of unused space. This can't be remedied by a smaller cooler because you can only cover the size of the die so you're limited here. You can't possibly have a larger area of contact unless you have a bigger chip, regardless of how big your cooler is. Then it gets worse...
That's how small the actual contact area is beneath the casing and that's limited by design. The only way to do anything here would be to fill in the void beneath the cap and around that tiny contact point then replace the casing back. Soldering here isn't going to help (much) as it's still making only minimal contact for heat dissipation.
Difficult. You run the risk of fucking up your board and processor and obviously neither would be covered under warranty. Plus it really doesn't look like it would make a difference. The biggest takeaway from that thread should be the actual contact size and just how small Ivy Bridge really is.
