Silent.Sin
Gawd
- Joined
- Jun 23, 2003
- Messages
- 969
I've noticed that my 3850 512 (dual slot cooler) has been artifacting more than it used to in some of the more demanding games without the ambient temp changing at all. Enough to make me wonder if it would do me some good to remount the heatsink with some better TIM.
I've seen at least one article that I can't seem to find again that had a few tricks outlined in order to get better heatsink contact via increased pressure. I think they used pieces of zip tie stuck in-between the backside mounting bracket and the PCB to sort of "pull" the top side (chip-side) closer.
Does anyone here have any experience using a bit of hackery to get these heatsinks fastened a little tighter to the board without the need for a remount job? The heatsink uses pads to interface with the memory chips so these would benefit especially from any added pressure that can be applied. Would strapping ordinary zip ties around the whole shebang do the trick? What about the trick I mentioned above? Thanks for any advice.
I've seen at least one article that I can't seem to find again that had a few tricks outlined in order to get better heatsink contact via increased pressure. I think they used pieces of zip tie stuck in-between the backside mounting bracket and the PCB to sort of "pull" the top side (chip-side) closer.
Does anyone here have any experience using a bit of hackery to get these heatsinks fastened a little tighter to the board without the need for a remount job? The heatsink uses pads to interface with the memory chips so these would benefit especially from any added pressure that can be applied. Would strapping ordinary zip ties around the whole shebang do the trick? What about the trick I mentioned above? Thanks for any advice.